Description
Application: automatic – manual printer
The no-clean lead-free solder paste 158-A was developed for SMT assembly and other applications in the electronics industry that require products free of any lead. Its formula offers excellent wetting, excellent stencil durability, longer tack time (8 hours), high printing speed (6 in/s), and a longer shelf life.
Transparent and with a low level of residue that is also not corrosive nor conductive, it allows for a high level of cleanliness and easier needle test. High performance in a controlled environment.
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