Description
Application: automatic – manual printer
The no-clean solder paste NC 155A was developed for SMT assembly and other applications in the electronics industry. Its formula offers excellent OSP wetting, excellent stencil durability (8 hours), longer tack time (up to 24 hours), high printing speed (8 in/s), and a longer shelf life.
Transparent and with a low level of residue that is also not corrosive nor conductive, it allows for a high level of cleanliness, and easier needle tests. High performance in a controlled environment.
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