| Type: | Coreless |
|---|---|
| Form: | Ribbon |
| Alloy Sn x Pb x Ag x Bi | 25 x 62 x 3 x 10 |
| Tin (Sn): | 25% |
| Lead (Pb): | 62% |
| Silver (Ag): | 3% |
| Bismuth (Bi): | 10% |
| Product description: | 213 a 24 |
| Code: | 1580 |
| TALK TO SUPPLIER | |
| Single package | |
|---|---|
| Unit | Spool approx. 1kg. |
| Sealed package | |
| Quantity | 20 units |
| Net weight | 20 Kg. |
This solder was developed for the electronics industry, for soldering on surfaces with medium oxidation levels.The ribbon form factor allows for internal soldering of parts that will be heated in an oven, where soldering happens simultaneously.
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