| Type: | No-Clean | |
|---|---|---|
| Form: | Wire | |
| Alloy Sn x Ag x Cu | 99,0 x 0,3 x 0,7 | |
| Tin (Sn): | 99% | |
| Silver (Ag): | 0,3% | |
| Copper (Cu): | 0,7% | |
| Product description: | 228 | |
| Resina: | L | |
| Código: | TALK TO SUPPLIER | |
| Single package | ||||||
|---|---|---|---|---|---|---|
| Spool | 125g | 200g | 250g | 500 g. | 1 Kg. | 5 kg. |
| Sealed package | ||||||
| Quantity | — | — | — | 20 units | — | — |
| Peso neto | — | — | — | 10 kg. | — | — |
The Cast no-clean lead-free solder wire 228-L was developed for the electronics industry, where solder free of lead is required, and with halogen-free flux, for manual soldering that does not require clean-up after soldering. With cleaning agents.
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