Description
Application: automatic – manual printer
The no-clean lead-free solder paste 157-A was developed for SMT assembly and other applications in the electronics industry that require products free of any lead. Its formula offers excellent wetting; excellent stencil durability, longer tack time (8 hours), high printing speed (6 in/s), and a longer shelf life.
Transparent and with a low level of residue that is also not corrosive nor conductive, it allows for a high level of cleanliness and easier needle test. High performance in a controlled environment.
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